Cailong

Product Overview

Copper metallized PET film is produced by depositing a high-purity copper layer onto a stable flexible film substrate through roll-to-roll physical vapor deposition. It is intended for customers who need a lightweight functional coating with electrical and thermal conductivity while retaining the mechanical properties and processability of the base film. The copper surface can support electromagnetic shielding, heat dissipation, conductive tape, electronic circuit and anti-counterfeit label applications. Common substrate thickness ranges from 10 μm to 150 μm, with width and length customized to the converting requirement. Material selection should be based on the required conductivity, substrate, downstream lamination or coating process, and the conditions of the final industrial application.

Key Performance

• High-purity copper coating produced by PVD

• Common substrate thickness: 10 μm to 150 μm

• Electrical and thermal conductivity

• Good mechanical properties and thermal stability

• Customized width and length available

Applications

• Electromagnetic shielding

• Electronic circuits and heat dissipation

• Conductive and electronic tapes

• Anti-counterfeit labels

• Decorative and other functional materials

FAQ

What is copper metallized PET film used for?

It is used where a flexible material needs a conductive copper surface, including electromagnetic shielding, electronic tapes, circuits, heat dissipation and functional labels.

How is the copper layer applied?

The copper layer is deposited on the flexible substrate through roll-to-roll physical vapor deposition.

How should customers choose the right specification?

Selection depends on the required substrate thickness, conductivity, width, length, converting process and final application conditions.